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Siemens Electronic Componets

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S + M
DESIGNING THE FUTURE

Development and production of high-grade soft-magnetic ferrites with superior properties - that is the strength of S + M Components in the field of "black ceramics".

Exemplified by the high initial permeability that, together with a wide frequency range, is specially achieved for broadband transformers in digital telecommunications.Core competence down to the materials Iron, manganese, zinc and nickel oxides form the material base.

Using microengineering techniques, materials and products with very special features are continually being developed from them. A patented flexible film of FPC (ferrite polymer composite), for example, not only exhibits stable magnetic characteristics. It is also mechanically insensitive, supports high loads and is 40% lighter than conventional ferrites. This film is suitable for flexible coils and multilayer inductors, in field focusing applications, and especially for flat coils (coil on chip), plus EMC applications because of its shielding effect.

True to form
The wide range of products is attuned to all demands. Selected materials, optimized core shapes for flat assemblies and automated placement - especially SMT - are the rule, as are tailored accessories.

Special-purpose cores
The latest example of an exceptional solution is a ferrite pot core of 155 mm diameter. This "world record holder" masters contactless energy transfer of up to 120 kW. It is destined for use in heavy machine tools and for designing inductive proximity switches with sensing distances of more than 100 mm.

Quality all along the line
A uniform quality assurance system makes sure that the strictest requirements are satisfied with no compromises along the way. It is backed by TQM (total quality management), with a quality philosophy to which all personnel are committed, from R & D through procurement and production to service. Manufacturing plants are all ISO 9000 certified of course.

The right information
You can receive more information about our products, detailed technical data, cores and components not mentioned here.